Optimal design for PPF heat sinks in electronics cooling applications

Journal of Electronic Packaging

Volumn 126, Issue 4, 2004, Pages 410-422

  Chen, Han Ting ^a   Horng, Jenn Tsong ^a   Chen, Po Li ^a   Hung, Ying Huei ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

CCD; DOE; Heat Sink; Optimal Thermal Design; PPF; Pressure Loss; RSM; SQP; Thermal Resistance

Indexed keywords

CHARGE COUPLED DEVICES; COOLING; ELECTRONIC EQUIPMENT; HEAT CONVECTION; HEAT RESISTANCE; HYDRODYNAMICS; POWER CONVERTERS; TELECOMMUNICATION SYSTEMS;

DOE; OPTIMAL THERMAL DESIGN; PARALLEL-PLAIN FIN (PPF); PRESSURE LOSS; RSM; SQP;

FINS (HEAT EXCHANGE);

EID: 13944258210     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1826078     Document Type: Article

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