Staggered heat sinks with aerodynamic cooling fins

Microelectronics Reliability

Volumn 44, Issue 7, 2004, Pages 1181-1187

  Leon, Octavio A ^a   De Mey, Gilbert ^a   Dick, Erik ^a   Vierendeels, Jan ^a  

^a GHENT UNIVERSITY   (Belgium)

Author keywords

Aerodynamic cooling fins; Heat sink optimization; Staggered cooling fins

Indexed keywords

AERODYNAMICS; COOLING; ELECTRIC POWER UTILIZATION; ENERGY DISSIPATION; FORCED CONVECTION; MICROELECTRONICS; OPTIMIZATION;

AERODYNAMIC COOLING FINS; HEAT SINK OPTIMIZATION; LIQUID COOLING; STAGGERED COOLING FINS;

FINS (HEAT EXCHANGE);

EID: 2942701924     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2004.03.003     Document Type: Conference Paper

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