Comparison between the standard and staggered layout for cooling fins in forced convection cooling

Journal of Electronic Packaging

Volumn 125, Issue 3, 2003, Pages 442-446

  Leon, Octavio ^a   De Mey, Gilbert ^a   Dick, Erik ^a   Vierendeels, Jan ^a  

^a GHENT UNIVERSITY   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

COMPRESSIBLE FLOW; COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; COOLING SYSTEMS; FORCED CONVECTION; HEAT FLUX; INCOMPRESSIBLE FLOW; LAMINAR FLOW; MATHEMATICAL MODELS; PRESSURE DROP; TURBULENT FLOW;

COOLING FINS; FORCED CONVECTION COOLING; HEAT TRANSFER FLUX; SOFTWARE PACKAGE FLUENT; THERMAL MODELING TECHNIQUE;

FINS (HEAT EXCHANGE);

EID: 0141918639     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1602709     Document Type: Article

References (14)

1. Incropera, F. P., 1988, "Convection Heat Transfer in Electronic Equipment Cooling," Int. J. Heat Mass Transfer, 110, Nov., pp. 1097-1111.
2. Kin, S. J., and Lee, S. W., 1996, Air Cooling Technology for Electronic Equipment, CRC Press, New York, pp. 2-46.
3. Azar, K., 2000, "The History of the Power Dissipation," J. Electronics Cooling, 6(2), pp. 42-50.
4. Maling, G. C., and Yeager, D. M., 1996, "Minimizing Acoustical Noise in Electronic Systems," J. Electronics Cooling, 2(2), pp. 14-17.
5. Soodphakdee, D., et al., 1998, "A Comparison of Heat Sink Geometries for Laminar Forced Convection: Numerical Simulation of Periodically Developed Flow," The Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Seattle, Washington, pp. 310-315.
6. Wirtz, R. A., and Colban, D. M., 1996, "Comparison of the Cooling Fin Performance of Staggered and In-Line Arrays of Electronic Packages," ASME J. Electron. Packag., 118, pp. 27-30.
7. Zhang, L. W., et al., 1997, "Heat Transfer Enhancement Mechanisms in Inline and Staggered Parallel-Plate Fin Heat Exchanger," Int. J. Heat Mass Transfer, 40, pp. 2307-2325.
8. Biber, C. R., 1996, "Applying Computational Fluid Dynamics to Heat Sink Design and Selection," J. Electronics Cooling, 2(1), pp. 22-25.
9. Holman, J. P., 1998, Heat Transfer, McGraw-Hill, New York, pp. 150-219.
10. Incropera, F. P., and De Witt, D. P., 1985, Introduction to Heat Transfer, John Wiley & Sons, New York, pp. 243-369.
11. Mereu, S., Sciubba, E., and Bejan, A., 18993, "The Optimal Cooling of a Stack of Heat Generating Boards with Fixed Pressure Drop, Flow Rate or Pumping Power," Int. J. Heat Mass Transfer, 36, pp. 3677-3686.
12. Fluent Incorporated, 1996, Software Manual, pp. 8-1-8-50.
13. Rohsenow, W. M., 1985, Handbook of Heat Transfer Fundamentals, pp. McGraw-Hill, New York, pp. 6-1-6-41.
14. Leóon, O., De Mey, G., and Dick, E., 2002, "Study of the Optimal Layout of Cooling Fins in Forced Convection Cooling," Microelectron. Reliab., 42, pp. 1101-1111.