Effect of atmospheric-plasma treatments for enhancing adhesion of au on parylene-c-coated protein chips

Journal of the Korean Physical Society

Volumn 44, Issue 5 I, 2004, Pages 1168-1172

  Hwang, Kyo Seon ^a   Park, Jung Ho ^a   Lee, Jeong Hoon ^b   Yoon, Dae Sung ^b   Kim, Tae Song ^b   Han, Inho ^c   Noh, Joo Hyon ^c  

^a Korea University   (South Korea)

^b Korea Institute of Science and Technology   (South Korea)

^c SMC Co Ltd   (South Korea)

Author keywords

Adhesion; Atmosphere plasma; Contact angle; Parylene c

Indexed keywords

EID: 2942674687     PISSN: 03744884     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Conference Paper

References (18)

1. R. Raiteri, M. Grattarola, H. J. Butt and P. Skladal, Sens, Actuat, B 79, 115 (2001).
2. G. Majni and G. Ottaviani, Appl. Phys. Lett. 31, 125 (1997).
3. U. Schmid, Sens. Actuat. A 97-98, 253 (2002).
4. S. Dabral, J. Van Etten, X. Zhang, C. Apblett, G.-R. Yang, P. Ficalora and J. F. McDonald, J. Electron. Mater. 21, 989 (1992).
5. M. A. Spivack and G. Ferrante, J. Electrochem. Soc. 119, 1592 (1969).
6. Y.-S. Yeh, W. J. James and H. Yasuda, J. Polym. Sci., Part B: Polym. Phys. 28, 545 (1990).
7. Y. H. Hyun Y. P. Lee, Y. V. Kudryavtsev and R. Gontarz, J. Korean Phys. Soc. 42, 1366 (2003).
8. Y. M. Jung, S. J. Ahn, E. R. Kim and H. Lee, J. Korean Phys. Soc. 40, 712 (2002).
9. K. S. Kim, Y. W. Kim, N. G. Park, W. S. Cho, Y. C. Park, C. N. Whang, S. S. Kim and D. S. Choi, J. Korean Phys. Soc. 31, 140 (1997).
10. K. S. Gadre and T. L. Alford, J. Appl. Phys. 93, 919 (2003).
11. A. Sharma and H. Yasuda, J. Adhesion 13, 201 (1982).
12. J. H. Lee, K. S. Hwang, J. Park, K. H. Yoon and T. S. Kim, Biosens, Bioelectr., submited (2003).
13. J. H. Lee, K. H. Yoon and T. S. Kim, Appl. Phys. Lett., submited (2003).
14. D. K. Owen, J. Appl. Polymer Sci. 13, 1741 (1969).
15. F. M. Fowkers, Ind. Eng. Chem. 56, 40 (1964).
16. T. E. Nowlin and D. Foss Smith, J. Appl. Polym. Sci. 25, 1619 (1980).
17. P. Kramer, A. K. Sharma, E. E. Hennecke and H. Yasuda, J. Polym. Sci.: Polym. Chem. ED. 22, 475 (1984).
18. Y.-S. Lin and H. K. Yasuda, J. Appl. Polym. Sci. 67, 855 (1998).