Correlation between microstructure and composition of Cu-In alloy

Transactions of Nonferrous Metals Society of China (English Edition)

Volumn 14, Issue 1, 2004, Pages 131-136

  Zhao, Cheng Zhi ^a   Guo, Jing Jie ^a   Su, Yan Qing ^a   Wu, Shi Ping ^a   Jia, Jun ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Composition; Cu In; Microstructure

Indexed keywords

COMPOSITION; CRYSTAL GROWTH; GRAIN SIZE AND SHAPE; INDIUM; MICROSTRUCTURE;

CELLULAR STRUCTURE; COLUMNAR GRAIN; DENDRITIC STRUCTURE; EQUIAXED GRAIN; PERITECTIC REACTION;

COPPER ALLOYS;

EID: 2942653156     PISSN: 10036326     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (17)

1. XU Zu-yao. Studies on phase transformations and their applications in materials engineering [J]. Heat Treatment, 2002, 17(1): 1-13.
2. YANG Kai, GU Cheng-lin. Research and application of the shape memory alloy [J]. Metallic Functional Materials, 2000, 7(5): 7-12.
3. JIANG Guo-sheng, WANG Zhi-fa, LIU Zheng-chun. Present status of the study on high-tungsten W-Cu composites [J]. Rare Metal and Hard Alloy, 1999 (136): 39-42.
4. GUI Yong-fu, SUN Xing-nan, ZHANG Jun. Properties of Cu50Cr50 contact material [J]. Rare Metal Material and Engineering, 1997, 26(5): 40-43.
5. Li W P, Thomas R L, Smith R K. Effects of Cr content on the interruption ability of CuCr contact materials [A]. IEEE 19th Int Symp on Discharges and Electrical Insulation in Vacuum-Xi'an-2000 [C]. 2000. 380-383.
6. Spaic S, Komac M, Fetahagic A. Microstructure and properties of sintered Cu-25Cr alloy [J]. Materials Science and Technology, 1989, 5(11): 1069-1073.
7. WANG Ya-ping, DING Bing-jun. The preparation and the properties of microcrystalline and nanocrystalline CuCr contact materials [J]. IEEE Transactions on Components and Packaging Technology, 1999, 22(2): 467-472.
8. Bregel T, Krauss-Vogt W, Michal R, et al. On the application of W/Cu materials in the fields of power engineering and plasma technology [J]. IEEE Transactions on Components, Hybrids and Manufacturing Technology, 1991, 14(1): 8-13.
9. Raghu T, Sundaresan R, Ramakrishnan P, et al. Synthesis of nanocrystalline copper-tungsten alloys by mechanical alloying [J]. Mater Sci Eng A, 2001, 304-306(1-2): 438-441.
10. JIA Cheng-chang, GUAN Xiu-hu, SU Xue-kuan, et al. Microstructure and properties of W-Cu alloys prepared with mechanically activated powder [J]. Journal of University of Science and Technology Beijing: Mineral Metallurgy Materials, 2001, 8(2): 129-132.
11. Rockett A, Birkmire R W. CuInSe2 for photovoltaic applications [J]. J Appl Phys, 1991, 70(7): 81-97.
12. Krunks M, Mikli V, Bijakina O, et al. Composition and structure of CuInS2 films prepared by spray pyrolysis [J]. Thin Solid Film, 2000, 361-362: 61-64.
13. Schaffler R, Klose M, Brieger M, et al. Pulsed laser deposition and characterization of CuInSe2 thin films for solar cell applications [J]. Mater Sci Forum, 1995, 173-174: 135-140.
14. Sudo Y, Endo S, Irie T. Preparation and characterization of electrodeposited CuInSe2 thin films [J]. Jpn J Appl Phys, 1993, 32: 1562.
15. Das A, Pabi K, Manna I. Kinetic of the eutectoid transformation in the Cu-In system [J]. Journal of Materials Science, 1999, 34: 1815-1821.
16. 0.3 from 298 K to 1273 K [J]. Z Metallkd. 1999, 90(1): 55-59.
17. HU Han-qi. Principles of Metal Solidification [M]. Beijing: Mechanical Industry Press, 2000. 127.