Curing and thermal property of boron-containing o-cresol formaldehyde resin

Chemical Journal on Internet

Volumn 6, Issue 2, 2004, Pages 15-20

  Xia, Liya ^a   Gao, Jungang ^a   Yu, Zhenxia ^a  

^a HEBEI UNIVERSITY   (China)

Author keywords

Boric acid; Boron containing phenol formaldehyde resin; O cresol; Thermal analysis

Indexed keywords

BORON ORTHO CRESOL FORMALDEHYDE RESIN; HYDROXYL GROUP; ORGANOBORON DERIVATIVE; OXYGEN; UNCLASSIFIED DRUG;

ARTICLE; CHEMICAL STRUCTURE; CROSS LINKING; DECOMPOSITION; DEGRADATION; DEGRADATION KINETICS; INFRARED SPECTROSCOPY; REACTION ANALYSIS; THERMAL ANALYSIS; THERMOGRAVIMETRY; THERMOSTABILITY;

EID: 2942607390     PISSN: 15231623     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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