Curing Behavior and Thermal Property of Epoxy Resin with Boron-Containing Phenol-formaldehyde Resin

Journal of Applied Polymer Science

Volumn 76, Issue 7, 2000, Pages 1054-1061

  Gao, Jungang ^a   Liu, Yanfang ^a  

^a HEBEI UNIVERSITY   (China)

Author keywords

Boron containing phenol formaldehyde resin; Curing kinetics; Epoxy resin; Glass transition temperature

Indexed keywords

EID: 0008311968     PISSN: 00218995     EISSN: None     Source Type: Journal    
DOI: 10.1002/(SICI)1097-4628(20000516)76:7<1054::AID-APP9>3.0.CO;2-Z     Document Type: Article

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