Re-examination on thermal stresses of bonded structures

Journal of Strain Analysis for Engineering Design

Volumn 39, Issue 3, 2004, Pages 261-270

  Wang, W C ^a   Hsu, J S ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Bonded structures; Finite element method; Photoelastic method; Thermal stresses

Indexed keywords

ELASTIC MODULI; FINITE ELEMENT METHOD; HIGH TEMPERATURE EFFECTS; PEELING; PHOTOELASTICITY; POISSON DISTRIBUTION; STRESSES; THERMAL EXPANSION; THERMAL STRESS;

BONDED STRUCTURES; INTERFACIAL SHEARING STRESS;

STRUCTURAL ANALYSIS;

EID: 2942579184     PISSN: 03093247     EISSN: None     Source Type: Journal    
DOI: 10.1243/030932404323042687     Document Type: Article

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