Wafer-scale modeling of pattern effect in oxide chemical mechanical polishing

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3212, Issue , 1997, Pages 236-247

  Ouma, Dennis ^a   Stine, Brian ^a   Divecha, Rajesh ^a   Boning, Duane ^a   Chung, James ^a   Shinn, Greg ^b   Ali, Iqbal ^b   Clark, John ^b  

^a USA   (United States)

^b TEXAS INSTRUMENTS   (United States)

Author keywords

Chemical mechanical polishing; Die level variation; Pattern density; Pattern effect; Planarization length; Polishing pad; Variation decomposition

Indexed keywords

PATTERN DENSITY; PATTERN EFFECT; PLANARIZATION LENGTH; POLISHING PAD; VARIATION DECOMPOSITION;

CHEMICAL POLISHING; DIELECTRIC FILMS; DIES; NANOTECHNOLOGY; POLISHING; THEOREM PROVING;

CHEMICAL MECHANICAL POLISHING;

EID: 2942561344     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.284597     Document Type: Conference Paper

References (17)

1. W. J. Patrick, W. L. Guthrie, C. L. Standley, and P. M. Schiable, "Application of Chemical Mechanical Polishing for the Fabrication of VLSI Circuit Interconnections," J. Electrochem. Soc., vol. 138, no. 6, pp. 1778-1784, June 1991.
2. S. Sivaram, H. Bath, R. Legegett, A. Maury, K. Monning, R. Tolles, "Planarizing Interlevel Dielectrics by Chemical-Mechanical Polishing," Solid State Tech. May 1992, pp. 87-91.
3. B. Stine, D. Boning, J. Chung, "Analysis and Decomposition of Spatial Variation in Integrated Circuit Processes and Devices," IEEE Trans. on Semi. Manuf., vol 10, No. 1, February, 1997.
4. D. Ouma, B. Stine, R. Divecha, D. Boning, J. Chung, I. Ali, and M. Islamraja, "Using Variation Decomposition Analysis to Determine the Effect of Process on Wafer and Die-Level Uniformities in CMP," First International Symposium on Chemical Mechanical Planarization (CMP) in IC Device Manufacturing, 190th Electrochemical Society Meeting, San Antonio, TX, Oct. 6-11, 1996.
5. 2 chemical-mechanical polishing planarization," in Proc. VMIC Conf., pp. 379-384, Santa Clara, CA, June 1991.
6. S. R. Runnels, "Feature-scale fluid-based erosion modeling for chemical-mechanical polishing," J. Electrochem. Soc., vol. 141, no. 7, pp. 1900-1904, July 1994.
7. S. Sivaram, H. Bath, E. Lee, R. Leggett, and R. Tolles, "Measurement and modeling of pattern sensitivity during chemical-mechanical polishing of interlevel dielectrics," SEMATECH, Austin, TX, Tech. Rep., 1992.
8. B. Stine, D. Ouma, R. Divecha, D. Boning, J. Chung, D. Hetherington, I. Ali, G. Shinn, J. Clark O. S. Nakagawa, S.-Y. Oh, "A Closed-Form Analytic Model for ILD Thickness Variation in CMP Processes," Proc. CMP-MIC Conf., Santa Clara, CA, Feb. 1997.
9. Y. Hayashide, M. Matsuura, M. Hirayama, T. Sasaki, S. Harada, H. Kotani, "A novel optimization method of chemical mechanical polishing (CMP)", in Proc. VMIC Conf., pp. 464-470, Santa Clara, CA, June 1995.
10. G. Nanz and L. Camilletti, "Modeling of Chemical-Mechanical Polishing: A Review," IEEE Trans. on Semi. Manuf., vol 8, no. 4, November, 1995.
11. J. Warnock, "A two-dimensional process model for chemimechanical polish planarization," J. Electrochem. Soc., vol. 138, no. 8, pp. 2398-2402, Aug. 1991.
12. F.W. Preston, "The Theory and Design of Plate Glass Polishing Machines," J. Soc. Glass Technol., XI, 214 (1927).
13. D. Wang, J. Lee, K. Holland, T. Bibby, S. Beaudoin, and T. Cale, "Von Mises Stress in Chemical-Mechanical Polishing Processes," J. Electrochem. Soc., vol. 144, no. 3, pp. 1121-1127, March 1997.
14. B. Stine, D. Ouma, R. Divecha, D. Boning, J. Chung, D. Hetherington, C. R. Harwood, O. S. Nakagawa, and S.-Y. Oh, "Rapid Characterization and Modeling of Pattern Dependent Variation in Chemical Mechanical Polishing," to appear, IEEE Trans. on Semi. Manuf.
15. J. S. Lim, "Two-Dimensional Signal and Image Processing," Chap. 4-5, Prentice Hall, Englewood Cliffs, NJ, 1990.
16. Boning, D., J. Chung, D. Ouma, and R. Divecha, "Spatial Variation in Semiconductor Processes: Modeling for Control," 191st Meeting of the Electrocehm. Soc, Montreal, May 1997.
17. P. Mozumder and L. Lowenstein, "Method for Semiconductor Process Optimization Using Functional Representations of Spational Variations and Selectivity," IEEE CPMT, vol. 15, no. 3, pp. 311-316, June 1992.