Temperature rise during adhesive and resin composite polymerization with various light curing sources

Operative Dentistry

Volumn 29, Issue 3, 2004, Pages 325-332

  Ozturk, B ^a,b   Ozturk, A N ^a   Usumez, A ^a   Usumez, S ^a   Ozer F ^a  

^a SELCUK UNIVERSITY   (Turkey)

^b Campus/Konya   (Turkey)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE AGENT; HALOGEN; RESIN; SILICON DIOXIDE; TUNGSTEN;

APPARATUS; ARTICLE; COMPOSITE MATERIAL; CONTROLLED STUDY; DENTIN; DEVICE; ENERGY; HEATING; HIGH TEMPERATURE; HUMAN; HUMAN TISSUE; ILLUMINATION; LIGHT; LIGHT EMITTING DIODE; PHOTOACTIVATION; POLYMERIZATION; PREMOLAR TOOTH; TEMPERATURE MEASUREMENT; THERMODYNAMICS;

ANALYSIS OF VARIANCE; BISPHENOL A-GLYCIDYL METHACRYLATE; BODY TEMPERATURE; COMPOSITE RESINS; DENTAL EQUIPMENT; DENTIN; HALOGENS; HUMANS; LIGHT; METHACRYLATES; MOLECULAR STRUCTURE; PHOSPHORIC ACIDS; RESIN CEMENTS; SEMICONDUCTORS; SIGNAL PROCESSING, COMPUTER-ASSISTED; TECHNOLOGY, DENTAL; TRANSITION TEMPERATURE; XENON;

EID: 2942546375     PISSN: 03617734     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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