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Volumn 119, Issue 6, 2001, Pages 610-616

Rapid curing of bonding composite with a xenon plasma arc light

Author keywords

[No Author keywords available]

Indexed keywords

BISPHENOL A BIS(2 HYDROXYPROPYL) ETHER DIMETHACRYLATE; RELIANCE LIGHT BOND; RESIN; RESIN CEMENT; TRANSBOND; TUNGSTEN; XENON;

EID: 0035379778     PISSN: 08895406     EISSN: None     Source Type: Journal    
DOI: 10.1067/mod.2001.113652     Document Type: Article
Times cited : (86)

References (21)
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.