Development of an anodically-bonded test surface to obtain fundamental liquid immersion thermal management data for electronic devices

Sensors and Actuators, A: Physical

Volumn 113, Issue 2, 2004, Pages 212-217

  Nimkar, Nitesh D ^a   Bhavnani, Sushil H ^a   Ellis, Charles D ^a   Jaeger, Richard C ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

Anodic bonding; Cooling; Dielectric liquids; Etching; Multichip modules

Indexed keywords

ACTUATORS; AMMONIUM COMPOUNDS; CHEMICAL BONDS; COOLING; DIELECTRIC LIQUIDS; ETCHING; HEAT SINKS; MULTICHIP MODULES;

ANODIC BONDING; CRITICAL HEAT FLUX (CHF); ELECTRONIC DEVICES; ZUBER CORRELATION;

ELECTRONIC EQUIPMENT;

EID: 2942544510     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2004.02.028     Document Type: Article

References (12)

1. F.P. Incropera, Liquid Cooling of Electronic Devices by Single Phase Convection, first ed., Wiley, Canada, 1999.
2. International Technology Roadmap for Semiconductors [ITRS], 2000, Update http://www.semichips.org.
3. Bar-Cohen A. Thermal management of electronic components with dielectric liquids. JSME Int. J. Ser. B. 1:1993;1-25.
4. G.M. Chrysler, R.C. Chu, R.E. Simons, in: Proceedings of the ASME Itherm-1994 on Jet Impingement Boiling of a Dielectric Coolant in Narrow Gaps, 1994, pp. 1-8.
5. Bhavnani S.H., Tsai C.P., Jaeger R.C., Eison D.L. An integral heat sink for cooling microelectronic components. J. Electron. Packaging. 115(3):1993;284-291.
6. Goyal A., Jaeger R.C., Bhavnani S.H., Ellis C.D., Phadke N.K., Azimi-Rashti M., Goodling J.S. Formation of silicon reentrant cavity heat sink using anisotropic etching and direct wafer bonding. IEEE Electron Device Lett. 14(1):1993;29-32.
7. Berthold A., Nicola L., Sarro P.M., Vellekoop M.J. Glass-to-glass anodic bonding. SAFE. 99:1999;33-36.
8. A. Berthold, L. Nicola, P. M. Sarro, M. J. Vellekoop, A Novel Technological Process for Glass to Glass Anodic Bonding, Transducers '99, 1999.
9. K. Zsolt, Integrated Resonant Magnetic Field Sensor, Ph.D. Dissertation, Delft University of Technology, Delft, The Netherlands, 1997.
10. Choi W.B., Ju B.K., Lee Y.H., Jeong S.J., Lee Y.H., Sung M.Y., Oh M.H. Glass-to-glass bonding for vacuum packaging of field emission display in an ultra-high-vacuum chamber using silicon thin film. J. Electrochem. Soc. 146(1):1999;400-404.
11. Fournelle G., Bhavnani S.H., Jaeger R.C. Optical study of enhanced heat transfer from a heat sink for microelectronic applications. Adv. Electron. Packag. 2:1999;1463-1469.
12. Bhavnani S.H., Balch S.E., Jaeger R.C. Control of incipience hysteresis effects in liquid cooled electronic heat sinks. J. Electron. Manufact. 9(2):1999;179-190.