New method for fabrication of SU8 structures with a high aspect ratio using a mask-back exposure technique

Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors

Volumn 25, Issue 1, 2004, Pages 26-29

  Yi, Futing ^a   Miao, Peng ^b   Peng, Liangqiang ^a   Zhang, Jufang ^a   Han, Yong ^a  

^a INSTITUTE OF HIGH ENERGY PHYSICS   (China)

^b IMPERIAL COLLEGE LONDON   (United Kingdom)

Author keywords

Back exposure; MEMS; Microfabrication; SU8 resist

Indexed keywords

FABRICATION; ULTRAVIOLET RADIATION;

BACK EXPOSURE; MICROFABRICATION; SU8 RESIST;

MICROELECTROMECHANICAL DEVICES;

EID: 2942542971     PISSN: 02534177     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (5)

1. Despont M, Lorenz H, Fahrni N, et al. High-aspect-ratio, ultrathick, negative-tone near-UV photoresist for MEMS applications. Proc of the 10th Int IEEE Workshop on Microelectro Mechanical Systems, 1997: 518
2. http://dmtwww.epfl.ch/ims/micsys/projects/su8
3. Lee K Y, LaBianca N, Rishton S A, et al. Micromaching application of a high resolution ultrathick photoresist. J Vac Sci Technol B, 1995, 13(6): 3012
4. Lorenz H, Despont M, Vettiger P, et al. Fabrication of photo-plastic high-aspect ratio microparts and micromolds using SU-8 UV resist. Microsystem Technologies, 1998, 4: 143
5. Cremers C, Bouamrane F, Singleton L, et al. SU-8 as resist material for deep X-ray lithography. Microsystem Technologies, 2001, 7: 11