Double-sided IPEM cooling using miniature heat pipes

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 4, 2005, Pages 852-861

  Martens, Timothy J ^a   Nellis, Gregory F ^a   Pfotenhauer, John M ^a   Jahns, Thomas M ^a  

^a UNIVERSITY OF WISCONSIN MADISON   (United States)

Author keywords

Heat pipe; Integrated power electronic module (IPEM); Power electronics; Thermal management

Indexed keywords

COOLING; ELECTRIC CONDUCTANCE; ELECTRIC CONDUCTIVITY; FINITE ELEMENT METHOD; HEAT FLUX; HEAT PIPES; MATHEMATICAL MODELS; SOLDERED JOINTS; SPECIFIC HEAT; THERMAL GRADIENTS;

DOUBLE-SIDED COOLING; INTEGRATED POWER ELECTRONIC MODULE (IPEM); SPATIAL TEMPERATURE GRADIENTS; THERMAL MANAGEMENT;

POWER ELECTRONICS;

EID: 29244478330     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.848591     Document Type: Article

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