An integrated methodology for multiobjective optimal component placement and heat sink sizing

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 4, 2005, Pages 869-876

  Gopinath, Deepak ^a   Joshi, Yogendra ^b   Azarm, Shapour ^c  

^a GENERAL MOTORS CORPORATION   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^c UNIVERSITY OF MARYLAND   (United States)

Author keywords

Compact thermal models; Genetic algorithms; Heat sink sizing; Multiobjective optimization; Optimal component placement

Indexed keywords

GENETIC ALGORITHMS; HEAT RESISTANCE; HEAT SINKS; MATHEMATICAL MODELS; NUSSELT NUMBER; OPTIMIZATION; POWER ELECTRONICS; PRANDTL NUMBER; REYNOLDS NUMBER; SPECIFIC HEAT;

COMPACT THERMAL MODELS; HEAT SINK SIZING; MULTIOBJECTIVE OPTIMIZATION; OPTIMAL COMPONENT PLACEMENT; POWER ELECTRONICS PACKAGING;

ELECTRONICS PACKAGING;

EID: 29244464349     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.853174     Document Type: Article

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