Comparison of properties of silicon-containing poly(amide-imide)s

High Performance Polymers

Volumn 17, Issue 4, 2005, Pages 483-495

  Sava, Ion ^a   Bruma, Maria ^a   Schulz, Burkhard ^b   Köpnick, Thomas ^c  

^a PETRU PONI INSTITUTE OF MACROMOLECULAR CHEMISTRY   (Romania)

^b UNIVERSITY OF POTSDAM   (Germany)

^c Institute of Thin Film Technology and Microsensorics   (Germany)

Author keywords

Dimethylsilylene; Direct polycondensation; High thermal stability; Poly(amide imide)s; Thin films

Indexed keywords

CARBOXYLIC ACIDS; GLASS TRANSITION; PLASTIC FILMS; SILICON; SILICON WAFERS; THERMODYNAMIC STABILITY;

DIMETHYLSILYLENE; DIRECT POLYCONDENSATION; HIGH THERMAL STABILITY; POLY(AMIDE-IMDIDE)S;

POLYAMIDES;

EID: 29144504123     PISSN: 09540083     EISSN: None     Source Type: Journal    
DOI: 10.1177/0954008305044162     Document Type: Article

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