메뉴 건너뛰기




Volumn 15, Issue 3, 2003, Pages 347-359

New silicon-containing poly(imide-amide)s

Author keywords

Dimethylsilane; High thermal stability; Poly(amide imide)s; Very thin films

Indexed keywords

ATOMIC FORCE MICROSCOPY; DECOMPOSITION; GLASS TRANSITION; POLYCONDENSATION; SILICON; SPIN COATING; SYNTHESIS (CHEMICAL); THERMAL EFFECTS; THERMODYNAMIC STABILITY; THIN FILMS;

EID: 0041410009     PISSN: 09540083     EISSN: None     Source Type: Journal    
DOI: 10.1177/0954008303015003010     Document Type: Article
Times cited : (28)

References (18)
  • 14
    • 0041621128 scopus 로고
    • US Patent Specification 3,763,211
    • Heath D R and Wirth J G 1973 US Patent Specification 3,763,211
    • (1973)
    • Heath, D.R.1    Wirth, J.G.2
  • 17
    • 0003581640 scopus 로고
    • Hypercube Inc. (Ontario)
    • Hypercube Inc. (Ontario) 1994 Hyperchem Version 4.0
    • (1994) Hyperchem Version 4.0


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.