The thermal bus opportunity-A quantum leap in data center cooling potential

ASHRAE Transactions

Volumn 111 PART 2, Issue , 2005, Pages 732-745

  Leonard, Paul L ^a,b   Phillips, A L ^c  

^a ASHRAE ^*  (United States)

^b Kling   (United States)

^c Aavid Thermacore Europe Ltd   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DATA CENTER; DATA EQUIPMENT; HEAT LOAD DENSITY;

COST EFFECTIVENESS; DENSITY (SPECIFIC GRAVITY); OFFICE BUILDINGS; SERVERS; TELECOMMUNICATION INDUSTRY;

COOLING SYSTEMS;

EID: 29144448697     PISSN: 00012505     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)

1. Wilson, M., J.P. Wattelet, and K.W. Wert. 2004. A thermal bus system for cooling electronic components in high-density cabinets. ASHRAE Transactions 110(1).
2. Zuo, Z.J., L.R. Hoover, and A.I. Phillips. 2002. Advanced thermal architecture for cooling of high power electronics. IEEE Transactions on Components and Packaging Technologies 25(4) (December 2002):629-634.