Advanced thermal architecture for cooling of high power electronics

IEEE Transactions on Components and Packaging Technologies

Volumn 25, Issue 4, 2002, Pages 629-634

  Zuo, Zhijun ^a   Hoover, L R ^a   Phillips, A L ^a  

^a Aavid Thermacore Europe Ltd   (United States)

Author keywords

Chip to system level; Electronics cooling; Thermal architecture

Indexed keywords

CHIP SCALE PACKAGES; COMPUTER SYSTEMS; COOLING SYSTEMS; HEAT LOSSES; MICROPROCESSOR CHIPS; THERMAL EXPANSION; TRANSISTORS;

ELECTRONICS COOLING;

POWER ELECTRONICS;

EID: 0037004308     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2002.807995     Document Type: Conference Paper

References (8)

1. Fleck Research, "On the level," Electron. News, Aug. 1999.
2. A. Phillips, "Thermal bus for high power enclosures," Thermacore Internal Document, 2000.
3. Communications Between Thermacore and Hewlett Packard, Feb. 2001.
4. Communications Between Thermacore and Hewlett Packard, Aug. 2000.
5. DARPA, HERETIC Kick-Off Meeting Proceedings, 1999.
6. D. Benson, R. Mitchell, M. Tuck, and D. Palmer, "Ultrahigh-capacity micromachined heat pipes," Microscale Thermophys. Eng., vol. 2, pp. 21-30, 1998.
7. Z. Zuo, M. Noah, and K. Wert, "High heat flux heat pipe mechanisms for cooling of electronics," in Proc. Int. Conf. Thermal, Mech. Thermomech. Phen. Electron. Syst., 2000.
8. D. Khrustalev, "Loop thermosyphon thermal bus test report," Thermacore Internal Document, 2001.