BladeCenter midplane and media interface card

IBM Journal of Research and Development

Volumn 49, Issue 6, 2005, Pages 823-836

  Hughes, James E ^a   Patel, Pravin S ^a   Zapata, Ivan R ^a   Pahel Jr , Thomas D ^a   Wong, Jack P ^a   Desai, Dhruv M ^a   Herrman, Bradley D ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AVAILABILITY; CD-ROM; DATA COMMUNICATION SYSTEMS; FLOPPY DISK STORAGE; INTERFACES (COMPUTER); REDUNDANCY; RELIABILITY; SERVERS;

MEDIA INTERFACE CARD; MIDPLANE INTERFACE CARD; PROCESSOR BLADES; REDUNDANT INTERCONNECTS; SWITCH MODULES;

MULTIPROCESSING SYSTEMS;

EID: 28844504717     PISSN: 00188646     EISSN: 00188646     Source Type: Journal    
DOI: 10.1147/rd.496.0823     Document Type: Article

References (11)

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4. Plateau HS Mezz Connector System; see http://www.molex.com/cgi-bin/bv/ molex/index_login.jsp.
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8. A. Deutsch, "Electrical Characteristics of Interconnections for High-Performance Systems," Proc. IEEE 86, No. 2, 315-357 (February 1998).
9. "I/O Buffer Information Specification (IBIS)," Version 3.2, September 1999; see http://www.vhdl.org/pub/ibis/ver3.2/.
10. M. J. Crippen, R. K. Alo, D. Champion, R. M. Clemo, C. M. Grosser, N. J. Gruendler, M. S. Mansuria, J. A. Matteson, M. S. Miller, and B. A. Trumbo, "BladeCenter Packaging, Power, and Cooling," IBM J. Res. & Dev. 49, No. 6, 887-904 (2005, this issue).
11. PowerPlus (SSI) Connector System; see http://www.molex.com/cgi-bin/bv/ molex/index_login.jsp.