Effect of plasma treatment and TMCTS vapor annealing on the reinforcement of porous low-k films

Materials Research Society Symposium Proceedings

Volumn 863, Issue , 2005, Pages 67-72

  Kohmura, Kazuo ^a   Tanaka, Hirofumi ^a   Oike, Shunsuke ^a   Murakami, Masami ^a   Ono, Tetsuo ^a   Seino, Yutaka ^b   Kikkawa, Takamaro ^b,c  

^a ASSOCIATION OF SUPER ADVANCED ELECTRONICS TECHNOLOGIES ASET   (Japan)

^b NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

^c HIROSHIMA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; CROSSLINKING; FOURIER TRANSFORM INFRARED SPECTROSCOPY; PLASMA APPLICATIONS; POLYMERS; STRENGTH OF MATERIALS;

PLASMA TREATMENT; POROUS SILICA FILMS;

DIELECTRIC FILMS;

EID: 28844461204     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-863-b3.10     Document Type: Conference Paper

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