A novel organosiloxane vapor annealing process for improving elastic modulus of porous low-k films

Materials Research Society Symposium Proceedings

Volumn 812, Issue , 2004, Pages 85-90

  Kohmura, Kazuo ^a   Oike, Shunsuke ^a   Murakami, Masami ^a   Tanaka, Hirofumi ^a   Takada, Syozo ^b   Seino, Yutaka ^b   Kikkawa, Takamaro ^b,c  

^a ASSOCIATION OF SUPER ADVANCED ELECTRONICS TECHNOLOGIES ASET   (Japan)

^b NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

^c HIROSHIMA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; CROSSLINKING; DESORPTION; ELASTIC MODULI; ETHANOL; FOURIER TRANSFORM INFRARED SPECTROSCOPY; HARDNESS; MATHEMATICAL MODELS; NITROGEN; PERMITTIVITY; POROUS MATERIALS; SILICA; SILICONES; STRENGTH OF MATERIALS; TRANSMISSION ELECTRON MICROSCOPY;

INTERLAYER DIELECTRICS; LOW-K FILMS; PORE STRUCTURE; THERMAL DESORPTION SPECTROSCOPY (TDS);

DIELECTRIC FILMS;

EID: 12844277240     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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