Curing reaction characteristics and phase behaviors of biphenol type epoxy resins with phenol novolac resins

Thermochimica Acta

Volumn 440, Issue 1, 2006, Pages 60-67

  Ren, Shao Ping ^a,b,c   Lan, Yan Xun ^b   Zhen, Yi Quan ^a,b,c   Ling, You Dao ^a,b,c   Lu, Man Geng ^a,b  

^a Key Laboratory of Polymer Materials for Electronics   (China)

^b GUANGZHOU INSTITUTE OF CHEMISTRY   (China)

^c UNIVERSITY OF CHINESE ACADEMY OF SCIENCES   (China)

Author keywords

Curing kinetics; Liquid crystalline epoxy resin; Phase behaviors

Indexed keywords

CURING; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRONICS PACKAGING; ENCAPSULATION; EPOXY RESINS; PHASE COMPARATORS;

CURING KINETICS; LIQUID CRYSTALLINE EPOXY RESIN; PHASE BEHAVIOR;

PHENOLS;

EID: 28844448579     PISSN: 00406031     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tca.2005.10.009     Document Type: Article

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