Weibull statistics of silicon die fracture

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

Volumn , Issue , 2004, Pages 782-786

  Bohm, C ^a   Hauck, T ^a   Juritza, A ^b   Muller W H ^b  

^a Freescale Halbleiter Deutschland GmbH   (Germany)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; INTEGRATED CIRCUIT LAYOUT; SEMICONDUCTOR DEVICES; THERMAL EXPANSION; WEIBULL DISTRIBUTION;

3-POINT-BENDING (3PB); DIE FRACTURE; EDGE FLAWS; WEIBULL STATISTICS;

FRACTURE;

EID: 28444499395     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)

1. Jahresbericht 2003. Fraunhofer Institut für Werkstoffme-chanik IWM. (Freiburg, 2003), pp.38-39.
2. Bohm, C, Hauck, T., Müller, W.H., Juritza, A., "Probability of Silicon Fracture in Molded Packages, "_Proc. EuroSimE 2004, Brussels, May 2004, pp. 75-82.