Realization of LTCC modules for broadband applications

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

Volumn , Issue , 2004, Pages 235-239

  Chua, Kai M ^a   Lu, Albert Chee W ^a   Jin, Lin ^a   Fan, Wei ^a   Wong, Stephen Chee K ^a  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; SUBSTRATES;

BROADBAND APPLICATIONS; HIGH-FREQUENCY PERFORMANCE;

ELECTRONICS PACKAGING;

EID: 28444477026     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

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2. G.E. Ponchak, D. Chen, J.G. Yook and L.P.B. Katehi, "Filled via hole fences for crosstalk control of microstrip lines in LTCC," Proc. Int. Symp. Microelectron, pp. 96-100, 1998.
3. A. Sutono, A.M. Pham, J. Laskar, W.R. Smith, "RF/Microwave Characterization of Multilayer Ceramic-Based MCM Technology, " IEEE Trans. Adv. Packag., pp. 326-331, 1999.
4. G. Chen, K.L. Virga, G. Winkler, J.L. Prince, "Modelling the Performance of Embedded Gridded Plane Structures in LTCC," Proc. ECTC, pp. 1413-1418, 2003.