Modeling the performance of embedded gridded plane structures in LTCC

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 1413-1418

  Chen, Guang ^a   Virga, Kathleen L ^a   Winkler, Gert ^b   Prince, John L ^a  

^a UNIVERSITY OF ARIZONA   (United States)

^b ILMENAU UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; COMPUTER SIMULATION; ELECTRIC PROPERTIES; EQUIVALENT CIRCUITS; FINITE ELEMENT METHOD; LOW TEMPERATURE PROPERTIES; TRANSMISSION LINE THEORY;

EMBEDDED GRIDDED PLANE STRUCTURES; LOW TEMPERATURE CO-FIRED CERAMIC;

NETWORKS (CIRCUITS);

EID: 0037674387     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. A. Jancura, G. Chen, G. Winkler, J.L. Prince and K.L. Virga, "Frequency Domain Behavior of Solid and Gridded Reference Power/Ground Planes in LTCC Modules," Proc 52nd Electronics Components and Technology Conf, San Diego, CA, May. 2002, pp.52-56.
2. G. Chen, A Jancura, G. Winkler, J.L. Prince and K.L. Virga, "Accurate Frequency Domain Modeling of LTCC Solid-Gridded Plane Structures", Microwave and Optical Technology Letters, March, 2003.
3. LTCC application manual. http://www.dupont.com/mcm/gtapesys/index.html
4. C Jeung, S Kim, R Myoung, J Yun, "Design of LTCC RF Modules for Communication Systems", Ansoft "Empowering profitability" world wide workshop, 2002.
5. Agilent Advanced Design System User Manual.
6. Ansoft High Frequency Structure Simulator (version 8.5) user manual, November 2002.