High power planar interconnect for high frequency converters

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

Volumn , Issue , 2004, Pages 18-24

  Fillion, Ray ^a   Delgado, Eladio ^a   Beaupre, Richard ^a   McConnelee, Paul ^a  

^a GE GLOBAL RESEARCH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HIGH FREQUENCY CONVERTERS; HIGH VOLTAGE LEVEL; PACKAGING TECHNOLOGIES; WIRE PACKAGES;

CHIP SCALE PACKAGES; ELECTRIC POTENTIAL; ELECTRONICS PACKAGING; NATURAL FREQUENCIES; POWER CONVERTERS; POWER ELECTRONICS; SEMICONDUCTOR DEVICES; WIRE;

INTERCONNECTION NETWORKS;

EID: 28444470914     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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2. Lidlow, A., "Power Conversion: Meeting the Challenges of the Information Age", Automotive Age 1999.
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5. Monteiro, R. et al, ""DirectFET™ Power MOSFET Packaging Technology Enables Discrete Multiphase Converter Design Capable of up to 2MHz/phase operation", PCIM, China, March 2003.
6. Arzumanyan, A., et al, "Flip Chip Power MOSFET: A New Wafer Scale Packaging Technique," ISPSD, June 2001.
7. th European Microelectronics Conf. Venice Italy, May 1997.