Comparison of modeling techniques for the vibration analysis of printed circuit cards

Journal of Electronic Packaging, Transactions of the ASME

Volumn 114, Issue 4, 1992, Pages 378-383

  Pitarresi, J M ^a   Primavera, A A ^b  

^a BINGHAMTON UNIVERSITY   (United States)

^b UNIVERSAL INSTRUMENTS CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHARACTERIZATION; DYNAMIC RESPONSE; ELECTRONICS PACKAGING; MATHEMATICAL MODELS; MECHANICAL PROPERTIES; MECHANICAL TESTING; PERFORMANCE; RELIABILITY; SMART CARDS; SURFACE MOUNT TECHNOLOGY; VIBRATION CONTROL;

PRINTED CIRCUIT CARDS; VIBRATION ANALYSIS;

PRINTED CIRCUITS;

EID: 0026989242     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2905468     Document Type: Article

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