Through wafer interconnection technologies for advanced electronic devices

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

Volumn , Issue , 2004, Pages 1-6

  De Samber, Marc ^a   Nellissen, Ton ^a   Van Grunsven, Eric ^a  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

CELLULAR TELEPHONE SYSTEMS; CHIP SCALE PACKAGES; ELECTRIC EQUIPMENT; ELECTRICAL ENGINEERING; INTEGRATED CIRCUITS; PERSONAL DIGITAL ASSISTANTS; PORTABLE EQUIPMENT; PRINTED CIRCUIT BOARDS;

BALL GRID ARRAYS (BGA); CHIP SIZE PACKAGES (CSP); MINIATURIZATION; WAFER INTERCONNECTIONS;

INTERCONNECTION NETWORKS;

EID: 28444442333     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. Alexander Polyakov et al, "Comparison of Via-fabrication Techniques for Through-Wafer Electrical Interconnect Applications" ,accepted for publication at ECTC 2004.
2. Marc de Samber et al, "A new wafer level chip size MCM-D technology for cellular application", International Conference on High Density Interconnect and Systems packaging, 345-351, Santa Clara, 2001.
3. th European Microelectronics and Packaging Conference and exhibition, Friedrichshafen, Germany, June 23-25, 2003.
4. Marc de Samber et al, "Through wafer vias for power transistors", 3rd European Microelectronics and Packaging Symposium, Prague, Czech Republic, June 16-18, 2004.
5. Marc de Samber et al, "Low-Complexity MCM-D technology with Integrated Passives for high frequency applications", International journal of Microcircuits and Electronic Packaging, 21(2), p. 224-230, 1998.
6. th European Microelectronics and Packaging Conference and exhibition, Friedrichshafen, Germany, June 23-25, 2003.
7. Ton Nellissen et al, "Development of an Advanced Three-dimensional MCM-D substrate level patterning technique", 3rd European Microelectronics and Packaging Symposium, Prague, Czech Republic, June 16-18, 2004.