Harsh solder joint reliability tests by impact drop and highly accelerated life test (HALT)

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

Volumn , Issue , 2004, Pages 205-209

  Che, F X ^a   Pang, John H L ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; HIGH TEMPERATURE APPLICATIONS; STRAIN;

HIGHLY ACCELERATED LIFE TEST (HALT); THERMAL SHOCK;

SOLDERED JOINTS;

EID: 28444441305     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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3. Yu, Q., et al., "Dynamic Behavior of Electronics Package and Impact Reliability of BGA Solder Joints", Proc of InterSociety Conf. on Thermal Phenomena (2002), pp. 953-960.
4. Nelson, Wayne, Accelerated Testing: Statistical Models, Test Plans, and Data Analyses, John Willey and Sons Publication, (New York, 1990).
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6. JEDEC Standard (JESD22-A103-B: Condition B).
7. JEDEC Standard (JESD22-A106-A: condition C).
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