A time-domain surface integral technique for mixed electromagnetic and circuit simulation

IEEE Transactions on Advanced Packaging

Volumn 28, Issue 4, 2005, Pages 745-753

  Yang, Chuanyi ^a   Jandhyala, Vikram ^a  

^a University of Washington   (United States)

Author keywords

Coupled circuit electromagnetic (EM) simulation; Electromagnetic interference (EMI); Modified nodal analysis; Surface impedance; Time domain integral equation (TDIE)

Indexed keywords

BOUNDARY CONDITIONS; COMPUTER SIMULATION; GREEN'S FUNCTION; INTEGRAL EQUATIONS; SIGNAL INTERFERENCE; SKIN EFFECT; TIME DOMAIN ANALYSIS;

COUPLED CIRCUIT-ELECTROMAGNETIC (EM) SIMULATION; MODIFIED NODAL ANALYSIS; SURFACE IMPEDANCE; TIME DOMAIN INTEGRAL EQUATION (TDIE);

EQUIVALENT CIRCUITS;

EID: 28444438168     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2005.848389     Document Type: Article

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