Novel electro-chemical mechanical planarization using carbon polishing pad to achieve robust Ultra Low-k/Cu integration

Proceedings of the IEEE 2005 International Interconnect Technology Conference, IITC

Volumn , Issue , 2005, Pages 203-205

  Kondo, S ^a   Tominaga, S ^b   Namiki, A ^a   Yamada, K ^a   Abe, D ^b   Fukaya, K ^a   Shimada, M ^a   Kobayashi, N ^a  

^a SEMICONDUCTOR LEADING EDGE TECHNOLOGIES INC   (Japan)

^b Tokyo Roki Co Ltd   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON; COPPER; ELECTRODES; FABRICATION; INTERCONNECTION NETWORKS; NANOTECHNOLOGY;

CARBON POLISHING; PLANARIZATION;

ELECTROLYTIC POLISHING;

EID: 28244441894     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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