Empirical modeling of oxide CMP at chip scale

Microelectronic Engineering

Volumn 82, Issue 3-4 SPEC. ISS., 2005, Pages 686-694

  Wolf, H ^a   Streiter, R ^a   Rzehak, R ^b   Meyer, F ^b   Springer, G ^b  

^a FRAUNHOFER IZM   (Germany)

^b INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

Chip scale; Modeling; Oxide CMP

Indexed keywords

DATA PROCESSING; MICROPROCESSOR CHIPS; OPTIMIZATION;

CHIP SCALE; OXIDE CHEMICAL MECHANICAL PLANARIZATION (CMP);

CHEMICAL MECHANICAL POLISHING;

EID: 28044464935     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2005.07.085     Document Type: Conference Paper

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