Three dimensional imaging of microelectronic devices using a CrossBeam FIB

Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

Volumn , Issue , 2005, Pages 3-

  Lifshin, Eric ^a   Evertsen, James ^a   Principe, Edward ^b   Friel, John ^c  

^a STATE UNIVERSITY OF NEW YORK   (United States)

^b CARL ZEISS SMT AG   (Germany)

^c Princeton Gamma Tech   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DYNAMIC MODE IMAGING; FOCUSED ION BEAMS (FIB); MICROELECTRONIC DEVICES; THREE DIMENSIONAL IMAGING;

COMPUTER OPERATING SYSTEMS; ELECTRIC CURRENTS; ELECTRON GUNS; FOCUSING; IMAGE RECONSTRUCTION; INTERCONNECTION NETWORKS; ION BEAMS; MICROELECTRONICS; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; THREE DIMENSIONAL;

IMAGING TECHNIQUES;

EID: 28044458925     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (1)

1. Lifshin, E., Evertsen, J.J., Principe, E.L., Friel, J., "Three Dimensional Imaging of Microelectronic Devices Using a Cross Beam FIB", ISTFA 2004. Proceedings of the 30th International Symposium for Testing and Failure Analysis, 2004, p429-35.