SCOPUS 정보 검색 플랫폼

Volumn , Issue , 2005, Pages 92-95

Stress migration lifetime for Cu interconnects with CoWP-only cap

Author keywords

[No Author keywords available]

Indexed keywords

CU INTERCONNECTS; DIELECTRIC CAPS; STRESS MIGRATION LIFETIME; STRIP PROCESSES;

COBALT COMPOUNDS; COPPER; DIELECTRIC MATERIALS; ETCHING; FAILURE ANALYSIS; INTERCONNECTION NETWORKS;

STRESS ANALYSIS;

EID: 28044436027 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper

Times cited : (2)

References (13)

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