Nucleation of dynamic recrystallization at triple junctions in polycrystalline copper

Philosophical Magazine

Volumn 85, Issue 23, 2005, Pages 2653-2669

  Miura, H ^a   Sakai, T ^a   Andiarwanto, S ^a   Jonas, J J ^b  

^a UNIVERSITY OF ELECTRO COMMUNICATIONS   (Japan)

^b MCGILL UNIVERSITY   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; NUCLEATION; POLYCRYSTALLINE MATERIALS; PROBABILITY; RECRYSTALLIZATION (METALLURGY); STRAIN RATE;

COPPER POLYCRYSTALS; DYNAMIC RECRYSTALLIZATION (DRX); TRIPLE JUNCTIONS;

COPPER;

EID: 27944474313     PISSN: 14786435     EISSN: 14786443     Source Type: Journal    
DOI: 10.1080/14786430500154257     Document Type: Article

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