메뉴 건너뛰기




Volumn PART B, Issue , 2005, Pages 125-130

Convective boiling in silicon microchannels with localized heating and thermometry

Author keywords

[No Author keywords available]

Indexed keywords

HEAT FLUX; HEAT SINKS; HEATING; INTEGRATED CIRCUITS; MATHEMATICAL MODELS; OPTIMIZATION; SILICON; THERMOMETERS; UNCERTAIN SYSTEMS;

EID: 27744522596     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/icmm2005-75209     Document Type: Conference Paper
Times cited : (1)

References (9)
  • 2
    • 0033337616 scopus 로고    scopus 로고
    • Phase change in microchannel heat sinks with integrated temperature sensors
    • Jiang, L. A., Wong, M., Zohar, Y., 1999, Phase Change in Microchannel Heat Sinks with Integrated Temperature Sensors, Journal of Microelectromechanical Systems, Vol. 8, No. 4, pp. 358-365.
    • (1999) Journal of Microelectromechanical Systems , vol.8 , Issue.4 , pp. 358-365
    • Jiang, L.A.1    Wong, M.2    Zohar, Y.3
  • 3
    • 0036092366 scopus 로고    scopus 로고
    • Two-phase flow patterns, pressure drop, and heat transfer during boiling in minichannel flow passages of compact evaporators
    • Kandlikar, S. G., 2002, Two-Phase Flow Patterns, Pressure Drop, and Heat Transfer During Boiling in Minichannel Flow Passages of Compact Evaporators, Heat Transfer Engineering, Vol. 23, No. 1, pp. 5-23.
    • (2002) Heat Transfer Engineering , vol.23 , Issue.1 , pp. 5-23
    • Kandlikar, S.G.1
  • 4
    • 0031200344 scopus 로고    scopus 로고
    • Correlations for the prediction of boiling heat transfer in small-diameter channels
    • Kew, P. A., Cornwell, K., 1997, Correlations for the Prediction of Boiling Heat Transfer in Small-Diameter Channels, Applied Thermal Engineering, Vol. 17, No. 8-10, pp. 705-715.
    • (1997) Applied Thermal Engineering , vol.17 , Issue.8-10 , pp. 705-715
    • Kew, P.A.1    Cornwell, K.2
  • 6
    • 0019563707 scopus 로고
    • High-performance heat sinking for VLSI
    • Tuckerman, D. B., and Pease, R. F. W., 1981, High-Performance Heat Sinking for VLSI, IEEE Electron Device Letters, Vol. EDL2, No. 5, pp. 126-129.
    • (1981) IEEE Electron Device Letters , vol.EDL2 , Issue.5 , pp. 126-129
    • Tuckerman, D.B.1    Pease, R.F.W.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.