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Volumn 375, Issue 2, 2004, Pages 699-705

Microchannel experimental structure for measuring temperature fields during convective boiling

Author keywords

Heat exchanger; MicroChannel; Two phase convection

Indexed keywords

BOILING LIQUIDS; HEAT EXCHANGERS; HEAT TRANSFER; PREHEATING; RESISTORS; SENSORS; THERMOCOUPLES; TWO PHASE FLOW;

EID: 20344408290     PISSN: 02725673     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2004-61936     Document Type: Conference Paper
Times cited : (4)

References (12)
  • 2
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    • Forced convection and flow boiling heat transfer for liquid flowing through microchannels
    • Peng, X. F., and Wang, B.-X., 1993, "Forced Convection and Flow Boiling Heat Transfer for Liquid Flowing through Microchannels," Int. J. Heat Mass Transfer, 36, pp. 3421-3427.
    • (1993) Int. J. Heat Mass Transfer , vol.36 , pp. 3421-3427
    • Peng, X.F.1    Wang, B.-X.2
  • 3
    • 0031643130 scopus 로고    scopus 로고
    • Flow boiling through V-shape microchannels
    • Peng, X. F., Hu, H. Y., and Wang, B. X., 1998, "Flow Boiling Through V-Shape Microchannels," Experimental Heat Transfer, 11, pp. 87-100.
    • (1998) Experimental Heat Transfer , vol.11 , pp. 87-100
    • Peng, X.F.1    Hu, H.Y.2    Wang, B.X.3
  • 5
    • 0037234090 scopus 로고    scopus 로고
    • Size and shape effects on two-phase flow patterns in microChannel forced convective boiling
    • Lee, M., Wong, Y. Y., Wong, M., and Zohar, Y., 2003, "Size and Shape Effects on Two-phase Flow Patterns in MicroChannel Forced Convective Boiling," J. Micromech. Microeng., 13, pp. 155-164.
    • (2003) J. Micromech. Microeng. , vol.13 , pp. 155-164
    • Lee, M.1    Wong, Y.Y.2    Wong, M.3    Zohar, Y.4
  • 6
    • 0035278849 scopus 로고    scopus 로고
    • Nonuniform temperature distribution in electronic devices cooled by flow in parallel microchannels
    • Hetsroni, G., Mosyak, A., and Segal, Z., 2001, "Nonuniform Temperature Distribution in Electronic Devices Cooled by Flow in Parallel Microchannels," IEEE Trans. Components and Packaging Technologies, 24, pp. 16-23.
    • (2001) IEEE Trans. Components and Packaging Technologies , vol.24 , pp. 16-23
    • Hetsroni, G.1    Mosyak, A.2    Segal, Z.3
  • 10
    • 0019916789 scopus 로고
    • A graphical representation of the piezoresistance coefficients in silicon
    • Kanda, Y., 1982, "A Graphical Representation of the Piezoresistance Coefficients in Silicon," Trans. Electron Devices, ED-29, pp. 64-70.
    • (1982) Trans. Electron Devices , vol.ED-29 , pp. 64-70
    • Kanda, Y.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.