Swelling of SU-8 structure in Ni mold fabrication by UV-LIGA technique

Microsystem Technologies

Volumn 11, Issue 12, 2005, Pages 1272-1275

  Yi, Luo ^a   Xiaodong, Wang ^a   Chong, Liu ^a   Zhifeng, Lou ^a   Denan, Chu ^a   Dehui, Yu ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROFORMING; FABRICATION; FLUIDICS; NICKEL; OPTIMIZATION; SWELLING;

ELECTROFORMED STRUCTURES; HOT EMBOSSING; MICRO CHANNELS; UV-LIGA TECHNIQUES;

POLYMETHYL METHACRYLATES;

EID: 27644594405     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-005-0604-7     Document Type: Article

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