Solder jet technology for advanced packaging

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5825, Issue , 2005, Pages 615-621

  Gallagher, C ^a   Hughes, P J ^a   Tassie, P ^a   Rodgers, K ^a   Barton, J ^a   Justice, J ^a   Casey, D P ^a  

^a UNIVERSITY COLLEGE CORK   (Ireland)

Author keywords

Inkjet; Low cost packaging; flip chip; Solder

Indexed keywords

COSTS; FLIP CHIP DEVICES; GALLIUM NITRIDE; LIGHT EMITTING DIODES; RELIABILITY; SUBSTRATES;

FLEX AND STACKED SUBMOUNTS; PACKAGING COSTS; SOLDER JET TECHNOLOGY;

ELECTRONICS PACKAGING;

EID: 27644536064     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.605679     Document Type: Conference Paper

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