Adaptive sampling methodology for in-line defect inspection

ASMC (Advanced Semiconductor Manufacturing Conference) Proceedings

Volumn , Issue , 2005, Pages 25-31

  Bousetta, Ali ^a   Cross, Andrew J ^a  

^a KLA TENCOR CORPORATION   (United States)

Author keywords

Defect monitoring; Dynamic sampling; Excursion control; In line inspection

Indexed keywords

DEFECT MONITORING; DYNAMIC SAMPLING; EXCURSION CONTROL; IN-LINE INSPECTION;

COST EFFECTIVENESS; PRODUCTION; RISK ASSESSMENT; SEMICONDUCTOR MATERIALS;

ADAPTIVE SYSTEMS;

EID: 27644445636     PISSN: 10788743     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Nurani, Raman K., et al, In-line Defect Sampling Methodology in Yield Management: An Integrated Framework. IEEE Transactions on Semiconductor Manufacturing, vol. 9, No. 4, November 1996.
2. A. J Cross, Introduction to Sampling Optimization, Andrew Cross, Internal KLA-Tencor Document August 2003.
3. W.W Kuo, Adaptive in-line Sampling Strategies for Semiconductors Manufacturing, ESRC 96-35, and CSM-35. Jan. 1997.
4. C. Broughton, SPC Control (for Defect data), Internal KLA-Tencor Document June 2002.