Analytical modelling of solidification during temperature gradient TLP diffusion bonding

Materials Science Forum

Volumn 329, Issue , 2000, Pages 351-360

  Shirzadi, A A ^a   Wallach, E R ^a  

^a UNIVERSITY OF CAMBRIDGE   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM ALLOYS; BINARY ALLOYS; MATHEMATICAL MODELS; SHEAR STRENGTH; SOLIDIFICATION; THERMAL EFFECTS;

TEMPERATURE GRADIENT TRANSIENT LIQUID PHASE (TLP) DIFFUSION BONDING;

BONDING;

EID: 0033887753     PISSN: 02555476     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.4028/www.scientific.net/msf.329-330.351     Document Type: Article

References (12)

1. UK Patent 9709167.2, (6 May 1997).
2. Shirzadi A. A., PhD thesis, University of Cambridge, (1998).
3. Shirzadi A.A. and Wallach E.R., Science and Technology of Welding and Joining, Vol.2, 3, (1997), p 89-94.
4. Whitman W.G., American Journal of Science, Vol. XI, 62, (1926), p 126-132.
5. Pfann W.G., Transactions AIME, Vol. 203, (1955), p 961-964.
6. Tuah-Poku I., Dollar M. and Massalski T.B., Metallurgical Transactions A, Vol. 19A, (1988), p 675-686.
7. MacDonald W.D. and Eagar T.W., in The Metal Science of Joining, ed. Cieslak M.J. et al., The Minerals, Metals & Materials Society, (1992), p 93-100.
8. Nakagawa H., Lee C.H. and North T.H., Metallurgical Transactions A, Vol. 22A, (1991), p 543-555.
9. Zhou Y, Gale W.F. and North T.H., International Materials Reviews, Vol. 40, 5, (1995), p 181-196.
10. Tiller W.A., Journal of Applied Physics, Vol. 34, 9, (1963), p 2757-2762.
11. Shirzadi A.A. and Wallach E.R., accepted for publication in Acta Materialia.
12. Voller V.R. and Sundarraj S., Materials Science and Technology, Vol. 9, (1993), p 474-481.