Reliability evaluation of direct chip attached silicon carbide pressure transducers

Proceedings of IEEE Sensors

Volumn 2, Issue , 2004, Pages 635-638

  Okojie, Robert S ^a   Savrun, Ender ^b   Nguyen, Phong ^b   Nguyen, Vu ^b   Blaha, Charles ^c  

^a NASA GLENN RESEARCH CENTER   (United States)

^b Sienna Technologies Inc   (United States)

^c Akima Corporation   (United States)

Author keywords

High Temperature; Package; Pressure Sensor; Reliability; Silicon carbide

Indexed keywords

ELECTRIC POTENTIAL; HIGH TEMPERATURE EFFECTS; MICROPROCESSOR CHIPS; RELIABILITY; SENSITIVITY ANALYSIS; SILICON CARBIDE;

ACCELERATED STRESS TESTING (AST); HIGH TEMPERATURE; PACKAGE; PRESSURE SENSOR;

PRESSURE TRANSDUCERS;

EID: 27544467091     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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