Bulk micromachining technology for fabrication of two-level MEMS in standard silicon substrate

Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05

Volumn 2, Issue , 2005, Pages 1404-1405

  Sarajlic, E ^a   De Boer, M J ^a   Jansen, H V ^a   Arnal, N ^b   Puech, M ^b   Krijnen, G ^a   Elwenspoek, M ^a  

^a UNIVERSITY OF TWENTE   (Netherlands)

^b NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BULK MICROMACHINING TECHNOLOGY; MICROMECHANICAL STRUCTURES; ON-CHIPS ELECTRONICS; SILICON SUBSTRATES;

ASPECT RATIO; CRYSTALLINE MATERIALS; LOW TEMPERATURE EFFECTS; MICROELECTROMECHANICAL DEVICES; OPTICAL DEVICES; SCANNING; SILICON; SUBSTRATES;

MICROMACHINING;

EID: 27544464845     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2005.1497344     Document Type: Conference Paper

References (4)

1. Carley L R et al 2000 J. of Applied Physics 87 6680-5
2. Kim C H et al 2003 J. Microelectormech. Syst. 12(4) 470-8
3. Sarajlic E et al 2004 J.Micromech. Microeng. 14 S70-5
4. Adixen Micro Machining Systems (www.adixen.com)