Scalable flexible chip-level parylene package for high lead count retinal prostheses

Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05

Volumn 2, Issue , 2005, Pages 1973-1976

  Rodger, Damien C ^a,b   Weiland, James D ^b   Humayun, Mark S ^b   Tai, Yu Chong ^a  

^a CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

^b UNIVERSITY OF SOUTHERN CALIFORNIA   (United States)

Author keywords

BioMEMS; Neural prosthesis; Packaging; Parylene; Retinal prosthesis

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; CAPACITORS; INTRAOCULAR LENSES; MICROELECTROMECHANICAL DEVICES; OPTICAL INTERCONNECTS; PHOTOLITHOGRAPHY; PROSTHETICS; VISION;

BIOMEMS; NEURAL PROSTHESIS; PARYLENE; RETINAL PROSTHESIS;

CHIP SCALE PACKAGES;

EID: 27544449520     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2005.1497487     Document Type: Conference Paper

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