Polytronics - Electronics and systems on flexible substrates

2005 IEEE VLSI-TSA - International Symposium on VLSI Technology - VLSI-TSA-TECH, Proceedings of Technical Papers

Volumn , Issue , 2005, Pages 53-56

  Bock, Karlheinz ^a  

^a Fraunhofer Institute Reliability and Microintegration   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

FLEXIBLE ELECTRONICS; FLEXIBLE SUBSTRATES; POLYTRONICS;

INTEGRATED CIRCUITS; MICROELECTRONICS; PLASTICS; SEMICONDUCTOR DEVICES;

VLSI CIRCUITS;

EID: 27144543567     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/VTSA.2005.1497078     Document Type: Conference Paper

References (5)

1. Balde J. W. (Ed.), "Foldable Flex and Thinned Silicon Multichip Packaging Technology", Kluwer Academic-Publishers for IMAPS (Norwell, 2002) pp. 106-114
2. Landesberger C. et al., "New Dicing and Thinning Concept Improves Mechanical Reliability of Ultra Thin Silicon," Proc IEEE 01TH8562, ISBN 0-930815-64-5, March 2001, pp. 92-97
3. Bock K., "Flexible Electronics Systems - Polytronics", submitted to the Proceedings of the IEEE, to be publ. 2005
4. Digest and CD of the PIRA 04 Conference, 14th and 15th September 2004, London, UK
5. Digest and CD of the Cintelliq '04 Conference, 27th-28th September 2004, Cambridge, UK, presentations: 1)T.v. Werne, Plastic Logic, Leading edge plastic electronics. 2) W. Fix, PolyIC, Fast and stable integrated polymer ICs. 3) G. Schmidt, Infineon, Organic Electronics; Perspectives towards Applications, 4) K. Bock, Fraunhofer IZM, Polytronic Systems fabricated in R2R and T. Me Lean, Barriers to implementation of plastic electronics.