Mechanism of temperature-induced plastic deformation of amorphous dielectric films for MEMS applications

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2005, Pages 471-474

  Cao, Zhiqiang ^a   Zhang, Xin ^a  

^a BOSTON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL INSULATION LAYERS; SILICON OXIDE; STRESS HYSTERESIS; THERMAL EXPANSION COEFFICIENTS;

ELECTRIC INSULATION; MICROELECTROMECHANICAL DEVICES; MICROSTRUCTURE; PHYSICAL VAPOR DEPOSITION; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; PLASTIC DEFORMATION; THERMAL CYCLING; THERMAL EXPANSION; THICK FILMS; VISCOUS FLOW;

DIELECTRIC FILMS;

EID: 26844569896     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2005.1453969     Document Type: Conference Paper

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