Overall heat transfer coefficient between cooling die and extruded product

Transactions of the American Society of Agricultural Engineers

Volumn 48, Issue 4, 2005, Pages 1461-1469

  Lee, G ^a   Huff, H E ^b   Hsieh, F ^b  

^a Kangwon National University   (South Korea)

^b UNIVERSITY OF MISSOURI   (United States)

Author keywords

Cooling die; Meat analog; Overall heat transfer coefficient; Twin screw extrusion

Indexed keywords

COOLING SYSTEMS; GLYCOLS; HEAT TRANSFER; MOISTURE; PROTEINS; WATER;

COOLING DIE; MEAT ANALOG; OVERALL HEAT TRANSFER COEFFICIENT; TWIN-SCREW EXTRUSION;

DIES;

HEAT TRANSFER;

GLYCINE MAX;

EID: 26844440061     PISSN: 00012351     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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