A novel process for fabricating electrical contact SnO2/Ag composites by reciprocating extrusion

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 36, Issue 9, 2005, Pages 2441-2447

  Chen, Yu Liang ^a   Yang, Chih Fu ^b   Yeh, Jien Wei ^a   Hung, Shui Shu ^c   Lee, Shih Wei ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b TATUNG UNIVERSITY   (Taiwan)

^c Catcher Technology Company   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; ELECTRIC CONDUCTIVITY; ELECTRIC CONTACTS; ELECTRIC PROPERTIES; INTERFACES (MATERIALS); METAL EXTRUSION; POWDER METALS; SILVER; STRENGTH OF MATERIALS; THERMAL EFFECTS; THERMAL EXPANSION; TIN COMPOUNDS;

INTERFACE STRENGTH; POWDER COMPACTION; RECIPROCATING EXTRUSION;

METALLIC MATRIX COMPOSITES;

EID: 26244445587     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-005-0117-0     Document Type: Article

References (28)

1. Y.S. Shen, Pat Lattari, Jeffrey Gardner, and Harold Wiegard: ASM Metals Handbook, 10th ed., ASM INTERNATIONAL, Metals Park, OH, 1990, vol. 2, pp. 840-68.
2. Howard E. Boyer and Timothy L. Gall: Metals Handbook, Desk ed., ASM, Metals Park, OH, 1985, pp. 20.16-20.21.
3. N.S. Hoyer: ASM Metals Handbook, 9th ed., ASM INTERNATIONAL, Metals Park, OH, 1984, vol. 7, pp. 630-34.
4. M. Huck, A. Kraus, R. Michal, and K.E. Saeger: Proc. 36th IEEE Holm Conf. on Electrical Contacts, 1990, pp. 133-38.
5. M. Sun, Q. Wang, and M. Lindmayer: IEEE Trans. Component Packaging A, 1994, vol. 17 (3), pp. 490-94.
6. S.N. Khrain: IEEE Trans. Component Packaging A, 1996, vol. 19 (3), pp. 313-19.
7. J.W. Yeh, S.Y. Yuan, and C.H. Peng: Mater. Sci. Eng. A, 1998, vol. 252, pp. 212-21.
8. J.W. Yeh, S.Y. Yuan, and C.H. Peng: Metall. Mater. Trans. A, 1999, vol. 30A, pp. 2503-12.
9. J.W. Yeh, K.S. Liu, and H.S. Chu: Mater. Sci. Eng. A, 2000, vol. 277, pp. 25-32.
10. S. Chu, K.S. Liu, and J.W. Yeh: Metall. Mater. Trans. A, 2000, vol. 31A, pp. 2587-96.
11. H.S. Chu, K.S. Liu, and J.W. Yeh: J. Mater. Res., 2001, vol. 16, pp. 1372-80.
12. R. Asthana and P.K. Rohatgi: J. Mater. Sci., 1991, vol. 10, pp. 230-34.
13. S.W. Lee, J.W. Yeh, and Y.S. Liao: Adv. Eng. Mater., 2004, vol. 6, pp. 936-43.
14. S.W. Lee, H.Y. Wang, Y.L. Chen, J.W. Yeh, and C.F. Yang: Adv. Eng. Mater., 2004, vol. 6, pp. 948-52.
15. A.G. Every, Y. Tzou, D.P.H. Hasselman, and R. Raj: Acta Metall. Mater., 1992, vol. 40, pp. 123-29.
16. David Jiles: Introduction to the Electronic Properties of Materials, 1st ed., Chapman & Hall, London, 1994, pp. 48-49.
17. J.R. Davis, P. Allen, S.R. Lampman, and T.B. Zorc: ASM Metals Handbook, 10th ed., ASM INTERNATIONAL, Metals Park, OH, 1990, vol. 2, pp. 1156-58.
18. G.M. Gladysz and K.K. Chawla: Compos. Part A-Appl. Sci., 2001, vol. 32, pp. 173-78.
19. P.S. Turner: J. Res. NBS, 1946, vol. 37, p. 239.
20. S.Y. Chang, S.J. Lin, and Merton C. Flemings: Metall. Mater. Trans. A, 2000, vol. 31A, pp. 291-98.
21. Z.K. Chen and K. Sawa: IEEE Trans. Component Packaging A, 1998, vol. 21 (2), pp. 310-22.
22. Z.K. Chen and K. Sawa: IEEE Proc. 18th Int. Conf. on Electrical Contacts, Chicago, IL, 1996, pp. 238-51.
23. J. Swingler and J.W. McBride: IEEE Proc. 43rd IEEE Holm Conf. on Electrical Contacts, Philadelphia, PA, 1997, pp. 238-45.
24. J. Swingler and J.W. McBride: IEEE Trans. Component Packaging A, 1999, vol. 22 (1), pp. 27-37.
25. S. Kang and C. Brecher: IEEE Trans. Component Hybr., 1989, vol. 12 (1), pp. 32-38.
26. M.Z. Rong and Q.P. Wang: IEEE Proc. 39th IEEE Holm Conf. on Electrical Contacts, Pittsburgh, PA, 1993, pp. 33-36.
27. J.A. Dean: Lange's Handbook of Chemistry, 13th ed., McGraw-Hill Book Co., Singapore, 1987, pp. 4.61, 4.106, and 4.123.
28. H. Nouri, T.S. Davies, and J: Head: IEEE Proc. 44th IEEE Holm Conf. on Electrical Contacts, Arlington, VA, 1998, pp. 207-13.