SCOPUS 정보 검색 플랫폼

Volumn 76-77, Issue , 2001, Pages 31-34

New aqueous clean for aluminum interconnects: Part I. fundamentals

(9) Rath, D L a Ravikumar, R b Delehanty, D J c Filippi, R G c Kiewra, E W c Stojakovic, G b McCullough, K J c Miura, D D c Rhoads, B N c

a IBM T J WATSON RESEARCH CENTER (United States)

b INFINEON TECHNOLOGIES (United States)

c IBM MICROELECTRONICS (United States)

Author keywords

Aqueous acid; DRAMs; Galvanic corrosion; Passivation; Post Al RIE Clean

Indexed keywords

COPPER CORROSION; DYNAMIC RANDOM ACCESS STORAGE; GALVANIC CORROSION; MIXTURES; PASSIVATION;

ALUMINUM INTERCONNECTS; AQUEOUS ACIDS; DRAM DEVICES; ELECTROCHEMICAL POLARIZATION; PROTECTIVE PASSIVATION;

ALUMINUM CORROSION;

EID: 26144478313 PISSN: 10120394 EISSN: 16629779 Source Type: Book Series
DOI: 10.4028/www.scientific.net/SSP.76-77.31 Document Type: Conference Paper

Times cited : (10)

References (11)

1
- 0343524442
- K. Honda, D. Perry, J. O’Neil, R Molin, G Hansen, V. Leon, D. Petersen, and L. Roberson. Proceedings of the Fifth International Symposium on Cleaning Technology in Semiconductor Device Manufacturing (1998) 617
- (1998) Proceedings of the Fifth International Symposium on Cleaning Technology in Semiconductor Device Manufacturing , pp. 617
- Honda, K.¹ Perry, D.² O’Neil, J.³ Molin, R.⁴ Hansen, G.⁵ Leon, V.⁶ Petersen, D.⁷ Roberson, L.⁸

2
- 0031699891
- S. Bothra, H Sur, and V Liang, Annual Proceedings - Reliability Physics Symposium, IEEE, (1998) 150.
- (1998) Annual Proceedings - Reliability Physics Symposium, IEEE , pp. 150
- Bothra, S.¹ Sur, H.² Liang, V.³

3
- 0343088510
- F Tardif, P Patruno, T. Lardin, AS Royet, O. Demoliens, and J Torres, Proceedings of the Third International Symposium on Ultra Clean Processing of Silicon Surfaces, (1996) 335.
- (1996) Proceedings of the Third International Symposium on Ultra Clean Processing of Silicon Surfaces , pp. 335
- Tardif, F.¹ Patruno, P.² Lardin, T.³ Royet, A.S.⁴ Demoliens, O.⁵ Torres, J.⁶

4
- 0017943050
- T.A Shankoff, C C. Chang, and S.E Haszko, J.Electrochm.Soc., 125 (1978) 467.
- (1978) J.Electrochm.Soc. , vol.125 , pp. 467
- Shankoff, T.A.¹ Chang, C.C.² Haszko, S.E.³

5
- 84954413973
- U.S. Patent 4,368,220, issued 1/11/1983
- J.M. Eldridge, M.H. Lee, and G.C. Schwartz, U.S. Patent 4,368,220, issued 1/11/1983.
- Eldridge, J.M.¹ Lee, M.H.² Schwartz, G.C.³

6
- 84954408764
- Digest of Technical Papers, IEEE
- R. Ravikumar, H. Cichy, R G. Filippi, E W. Kiewra, D. L. Rath, and G Stojakovic, International Interconnect Technology Conference, Digest of Technical Papers, IEEE, (1998) 146.
- (1998) International Interconnect Technology Conference , pp. 146
- Ravikumar, R.¹ Cichy, H.² Filippi, R.G.³ Kiewra, E.W.⁴ Rath, D.L.⁵ Stojakovic, G.⁶

7
- 84954437506
- U.S. Patent 5,780,363, issued 7/14/1998
- D.J Delehanty, R. Jagannathan, K.J. McCullough, D.D. Miura, G.F. Ouimet Jr., D.L. Rath, B.N Rhoads, and F.J. Schmidt Jr., U.S. Patent 5,780,363, issued 7/14/1998.
- Delehanty, D.J.¹ Jagannathan, R.² McCullough, K.J.³ Miura, D.D.⁴ Ouimet, G.F.⁵ Rath, D.L.⁶ Rhoads, B.N.⁷ Schmidt, F.J.⁸

8
- 84954442580
- this conference
- R. Ravikumar, et al., “New Aqueous Clean for Aluminum Interconnects: Part II. Applications”, this conference.
- New Aqueous Clean for Aluminum Interconnects: Part II. Applications
- Ravikumar, R.¹

9
- 84985627262
- M.D. Crawford, J. Baumgart, M. Shoaei and W.R. Ernst, AIChE J., 34 (1988) 2012.
- (1988) Aiche J. , vol.34 , pp. 2012
- Crawford, M.D.¹ Baumgart, J.² Shoaei, M.³ Ernst, W.R.⁴

10
- 0017526237
- M Koudelkova, J. Augustynski and H. Berthou, J.EIectrochem.Soc., 124(1977)1165
- (1977) J.Eiectrochem.Soc , vol.124 , pp. 1165
- Koudelkova, M.¹ Augustynski, J.² Berthou, H.³

11
- 84954441663
- International Technology Roadmap for Semiconductors, Semiconductor Industry Association, (1999).
- (1999)

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.